Standard IEC standard · IEC 60249-3-1:1981

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

Status: Upphävd

· Ersätts av: IEC 61249-2-4:2001 , IEC 61249-2-7:2002 , IEC 61249-2-18:2002 , IEC 61249-2-19:2001 , IEC 61249-2-21:2003 , IEC 61249-2-5:2003 , IEC 61249-2-6:2003 , IEC 61249-2-11:2003 , IEC 61249-2-2:2005 , IEC 61249-2-1:2005 , IEC 61249-2-22:2005 , IEC 61249-2-23:2005 , IEC 61249-2-26:2005 , IEC 61249-2-8:2003 , IEC 61249-2-9:2003 , IEC 61249-2-10:2003 , IEC 61249-2-12:1999 , IEC 61249-2-13:1999
Omfattning
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.

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