1. Start

Standard IEC standard · IEC 60068-2-58:1999

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Status: Withdrawn

· Replaced by: IEC 60068-2-58:2004
Buy this standard

Standard IEC standard · IEC 60068-2-58:1999

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions
Subscribe on standards - Read more Dölj
Price: 520 SEK
standard ikon pdf

PDF

Price: 520 SEK
standard ikon

Paper

Show more Show less
Scope
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to

Subjects

Environmental testing (19.040) Electronic component assemblies (31.190)

Buy this standard

Standard IEC standard · IEC 60068-2-58:1999

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions
Subscribe on standards - Read more Dölj
Price: 520 SEK
standard ikon pdf

PDF

Price: 520 SEK
standard ikon

Paper

Show more Show less

Product information

Language: English

Written by: IEC

International title:

Article no: STD-124997

Edition: 2

Approved: 1/15/1999

No of pages: 17

Replaced by: IEC 60068-2-58:2004