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Standard IEC standard · IEC 60068-2-58:2015/AMD1:2017

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Status: Valid

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Standard IEC standard · IEC 60068-2-58:2015/AMD1:2017

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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Subjects

Environmental testing (19.040) Electronic component assemblies (31.190)

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Standard IEC standard · IEC 60068-2-58:2015/AMD1:2017

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions
Subscribe on standards - Read more Dölj
Price: 360 SEK
standard ikon pdf

PDF

Price: 360 SEK
standard ikon

Paper

Show more Show less

Product information

Language: English

Written by: IEC

International title:

Article no: STD-8027778

Edition: 4

Approved: 7/28/2017

No of pages: 7

Amendment: IEC 60068-2-58:2015