Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
SS-EN ISO 9453:2020
WARNING — National or regional regulations may limit the employment of certain alloys.
This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.