Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues
after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in
ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste
constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E).
NOTE This test method is also applicable to fluxes for use with lead-free solders. However, the soldering
temperatures may be adjusted with agreement between tester and customer.