Standard Swedish standard · SS-EN IEC 61189-2-807:2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA

Status: Valid

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Standard Swedish standard · SS-EN IEC 61189-2-807:2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA

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Subjects

Printed circuits and boards (31.180)