Standard IEC standard · IEC 61189-2:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Status: Withdrawn

· Replaced by: IEC 61189-2:2006 Corrected by: IEC 61189-2:1997/COR1:1997 Cor 1 Amended by: IEC 61189-2:1997/AMD1:2000

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Standard IEC standard · IEC 61189-2:1997

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Scope

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test met

Subjects

Printed circuits and boards (31.180)

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Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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