Standard IEC standard · IEC 61188-5-2:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Status: Valid

Buy this standard

Standard IEC standard · IEC 61188-5-2:2003

Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions

Subscribe on standards - Read more Dölj

Price: 3 900 SEK

PDF

Price: 3 900 SEK

Paper

Show more Show less

Scope

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Subjects

Printed circuits and boards (31.180) Electronic component assemblies (31.190)

Discount	- EUR	- SEK
Sum	EUR	SEK
Shipping	EUR	SEK
Vat	EUR	SEK
Total	EUR	SEK

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Subjects

Product information

Within the same area