1. Start

Standard IEC standard · IEC 60249-3-1:1981

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

Status: Withdrawn

· Replaced by: IEC 61249-2-4:2001 , IEC 61249-2-7:2002 , IEC 61249-2-18:2002 , IEC 61249-2-19:2001 , IEC 61249-2-21:2003 , IEC 61249-2-5:2003 , IEC 61249-2-6:2003 , IEC 61249-2-11:2003 , IEC 61249-2-2:2005 , IEC 61249-2-1:2005 , IEC 61249-2-22:2005 , IEC 61249-2-23:2005 , IEC 61249-2-26:2005 , IEC 61249-2-8:2003 , IEC 61249-2-9:2003 , IEC 61249-2-10:2003 , IEC 61249-2-12:1999 , IEC 61249-2-13:1999
Scope
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.

Subjects

Printed circuits and boards (31.180)