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Standard · IEC standard IEC 61249-2-38

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-38: Matériaux de base renforcés, plaqués et non plaqués - Feuille...

IEC 61249-2-38:2008 gives requirements for properties of di-functional non-halogenated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), co...

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Publicerad

2009-01-15

PDF · 910 SEK
Standard · IEC standard IEC 61182-7 Corr.1

Corrigendum 1 - Cartes imprimées - Description et transmission de données informatiques - Partie 7: Codification sous forme numérique des données d...

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Publicerad

2002-10-15

PDF · 0 SEK
Standard · IEC standard IEC 62496-1

Cartes à circuits optiques - Partie 1: Généralités

IEC 62496-1:2008 applies to optical circuit boards possessing all of the following general features: - transmit patterns with straight, cross, bending optical paths and input and output optical por...

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Publicerad

2009-01-15

PDF · 910 SEK
Standard · IEC standard IEC/PAS 62500

Process management for avionics - Guide for defining and performing highly accelerated tests in avionic systems

Specifies the targets assigned to highly accelerated tests, their basic principle, their scope of application and their implementation procedures. Is a methodological document aimed at facilitating...

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Publicerad

2006-12-06

PDF · 560 SEK
Standard · IEC standard IEC 60050-702 Cor2

Vocabulaire Electrotechnique International - Chapitre 702: Oscillations, signaux et dispositifs associés

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Publicerad

1994-12-01

PDF · 0 SEK
Standard · IEC standard IEC 60050-702 Cor1

Vocabulaire Electrotechnique International - Chapitre 702: Oscillations, signaux et dispositifs associés

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Publicerad

1992-05-31

PDF · 0 SEK
Standard · IEC standard IEC 61249-4-1

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the ma...

Gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing multilayer boards in lin...

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Publicerad

2008-02-06

PDF · 315 SEK
Standard · IEC standard IEC/PAS 62396-3

Process management for avionics - Atmospheric radiation effects - Part 3: Optimising system design to accommodate the Single Event Effects (SEE) of...

Provides guidance to those involved in the design of avionic systems and equipment. Builds on the initial guidance on the system level approach to Single Event Effects in IEC/TS 62396-1, considers ...

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Publicerad

2007-10-10

Upphävd

2008-08-28

PDF · 315 SEK
Standard · IEC standard IEC/TS 62396-3

Process management for avionics - Atmospheric radiation effects - Part 3: Optimising system design to accommodate the single event effects (SEE) of...

IEC/TS 62396-3:2008(E) provides guidance to those involved in the design of avionic systems and equipment and the resultant affects of atmospheric radiation induced Single Event Effects (SEE) on th...

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Publicerad

2008-09-18

PDF · 1.050 SEK
Standard · IEC standard IEC/PAS 62396-2

Process management for avionics - Atmospheric radiation effects - Part 2: Guidelines for single event effects testing for avionics systems

Provides guidance related to the testing of microelectronic devices for purposes of measuring their susceptibility to single event effects (SEE) induced by the atmospheric neutrons. Also shows how ...

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Publicerad

2007-10-10

Upphävd

2008-08-19

PDF · 315 SEK
Standard · IEC standard IEC/PAS 62396-5

Process management for avionics - Atmospheric radiation effects - Part 5: Guidelines for assessing thermal neutron fluxes and effects in avionics s...

Provides a more precise definition of the threat that thermal neutrons pose to avionics as a second mechanism for inducing single event upset in microelectronics.

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Publicerad

2007-10-10

Upphävd

2008-08-19

PDF · 315 SEK
Standard · IEC standard IEC/TS 62396-5

Process management for avionics - Atmospheric radiation effects - Part 5: Guidelines for assessing thermal neutron fluxes and effects in avionics s...

IEC TS 62396-5:2008 (E) provides a more precise definition of the threat that thermal neutrons pose to avionics as a second mechanism for inducing single event upset (SEU) in microelectronics. Addr...

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Publicerad

2008-09-18

PDF · 700 SEK
Standard · IEC standard IEC 60938-1

Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification

Applies to inductors designed for electromagnetic interference suppression intended for use within, or associated with, electronic or electrical equipment and machines. It is restricted to inductor...

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Publicerad

2006-12-06

PDF · 490 SEK
Standard · IEC standard IEC 60938-2

Fixed inductors for electromagnetic interference suppression - Part 2: Sectional specification

Applies to fixed conductors designed for electromagnetic interference suppression and which fall within the scope of the generic spedification, IEC 60938-1. It is restricted to fixed inductors for ...

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Publicerad

2006-12-06

PDF · 560 SEK
Standard · IEC standard IEC 61189-5

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies

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Publicerad

2006-09-21

PDF · 1.330 SEK
Standard · IEC standard IEC 60062

Marking codes for resistors and capacitors

specifies marking codes for resistors and capacitors and indexes for the dielectric material and the electrodes of plastic film and paper capacitors

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Publicerad

2004-12-08

PDF · 315 SEK
Standard · IEC standard IEC 60249-2-5 am5

Amendement 5

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Publicerad

2000-06-30

Upphävd

2002-03-05

Standard · IEC standard IEC 60249-2-6 am4

Amendement 4

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Publicerad

2000-06-30

Upphävd

2005-03-01

Standard · IEC standard IEC 60249-2-9 am5

Amendement 5

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Språk

Publicerad

2000-08-24

Upphävd

2005-03-01

Standard · IEC standard IEC 60249-2-10 am5

Amendement 5

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Publicerad

2000-08-24

Upphävd

2005-03-01

Standard · IEC standard IEC 60249-2-11 am4

Amendement 4

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Publicerad

2000-08-24

Upphävd

2002-01-01

Standard · IEC standard IEC 60249-2-14 am5

Amendement 5

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Publicerad

2000-08-24

Upphävd

2005-03-01

Standard · IEC standard IEC 60249-2-18 am3

Amendement 3

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Publicerad

2000-08-24

Upphävd

2005-03-01

Standard · IEC standard IEC 60249-2-16 am3

Amendement 3

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Publicerad

2000-08-22

Upphävd

2005-03-01

Standard · IEC standard IEC 60249-2-17 am3

Amendement 3

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Språk

Publicerad

2000-08-24

Upphävd

2005-03-01

Standard · IEC standard IEC/PAS 62239

Electronic component management plans

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Publicerad

2001-04-03

Upphävd

2003-05-19

PDF · 315 SEK
Standard · IEC standard IEC/PAS 62214

Generic performance specification for printed boards

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Publicerad

2001-02-13

Upphävd

2004-12-01

PDF · 315 SEK
Standard · IEC standard IEC/PAS 62213

Specification and characterization methods for nonwoven para-aramid reinforcement

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Publicerad

2001-02-13

Upphävd

2004-12-01

PDF · 315 SEK
Standard · IEC standard IEC/PAS 62212

Specification and characterization methods for nonwoven "E" glass mat

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Språk

Publicerad

2001-02-13

Upphävd

2004-12-01

PDF · 315 SEK
Standard · IEC standard IEC 61249-2-13

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-13: Collection de spécifications intermédiaires pour les m...

Gives requirements for properties of cyanate ester non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0,05 mm up to 6,4 mm.

Språk

Publicerad

2001-05-28

PDF · 420 SEK
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