3273 träffar på

SS-EN 60286-3
Standard · Ikraftsättning, endast offentliggörande SS-EN 60286-3

Förpackning av elektronikkomponenter för automatisk hantering - Del 3: Bandning av uttagslösa komponenter

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Språk

Publicerad

2007-11-05
PDF · 0 SEK
SS-EN 61190-1-3
Standard · Svensk standard SS-EN 61190-1-3

Material för elektronikmontering - Del 1-3: Fordringar på lodlegeringar och lod med eller utan flussmedel

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Språk

Publicerad

2007-10-08
PDF · 1.200 SEK
SS-EN 61988-4
Standard · Ikraftsättning, endast offentliggörande SS-EN 61988-4

Plasmapaneler - Del 4: Klimatisk och mekanisk provning

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Språk

Publicerad

2007-10-08
PDF · 0 SEK
SS-EN 61192-5
Standard · Ikraftsättning, endast offentliggörande SS-EN 61192-5

Elektroniktillverkning - Fordringar på utförande - Del 5: Efterarbete, ändring och reparation

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Språk

Publicerad

2007-10-08
PDF · 0 SEK
SS-EN 60191-1
Standard · Ikraftsättning, endast offentliggörande SS-EN 60191-1

Halvledarkomponenter - Mekaniska egenskaper - Del 1: Allmänna regler för konturritningar för diskreta komponenter

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Språk

Publicerad

2007-10-08
PDF · 0 SEK
SS-EN 60191-6-16
Standard · Ikraftsättning, endast offentliggörande SS-EN 60191-6-16

Halvledarkomponenter - Mekaniska egenskaper - Del 6-16: Terminologi för socklar för provning och gallring av BGA, LGA, FBGA och FLGA

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Språk

Publicerad

2007-10-08
PDF · 0 SEK
SS-EN 61076-3-106
Standard · Ikraftsättning, endast offentliggörande SS-EN 61076-3-106

Anslutningsdon för elektronikutrustning - Del 3-106: Rektangulära anslutningsdon - Detaljspecifikation för höljen för industribruk för 8-poliga skä...

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Språk

Publicerad

2007-10-08
PDF · 0 SEK
SS-EN 60679-1
Standard · Ikraftsättning, endast offentliggörande SS-EN 60679-1

Styrkristaller - Kvalitetsbestämda, kristallstyrda oscillatorer - Del 1: Artspecifikation

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Språk

Publicerad

2007-10-08
PDF · 0 SEK
SS-EN 61190-1-2
Standard · Ikraftsättning, endast offentliggörande SS-EN 61190-1-2

Material för elektronikmontering - Del 1-2: Fordringar på lodpasta för lödning av förbindningar för högre krav

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Språk

Publicerad

2007-10-08
PDF · 0 SEK
SS-EN 61760-2
Standard · Ikraftsättning, endast offentliggörande SS-EN 61760-2

Ytmonteringsteknik - Del 2: Transport och lagring av komponenter avsedda för ytmontering - Riktlinjer

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Språk

Publicerad

2007-10-08
PDF · 0 SEK
IEC 61188-5-5
Standard · IEC standard IEC 61188-5-5

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads o...

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to pro...

Språk

Publicerad

2007-11-15
PDF · 910 SEK
IEC 61188-5-8
Standard · IEC standard IEC 61188-5-8

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA,...

Provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coate...

Språk

Publicerad

2007-11-15
PDF · 490 SEK
IEC/TS 62454
Standard · IEC standard IEC/TS 62454

Structures mécaniques pour équipement électronique - Guide de conception: Dimensions d'interface et dispositions relatives au refroidissement par l...

Provides interface dimensions and cooling performance guidelines for cabinets, using water supplied heat exchangers. Is applicable to cabinets in accordance with the IEC 60297 (19 in) and IEC 60917...

Språk

Publicerad

2007-11-07
PDF · 910 SEK
IEC 61189-3
Standard · IEC standard IEC 61189-3

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnectio...

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblie...

Språk

Publicerad

2007-11-07
PDF · 1.750 SEK
IEC 62132-3
Standard · IEC standard IEC 62132-3

Circuits intégrés - Mesure de l'immunité électromagnétique, 150 kHz à 1 GHz - Partie 3: Méthode d'injection de courant (BCI)

This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from rad...

Språk

Publicerad

2007-10-10
PDF · 700 SEK
IEC 62421
Standard · IEC standard IEC 62421

Electronics assembly technology - Electronic modules

Provides a generic standard of electronic modules on which their sectional standards are based. Also provides a definition, business model, interface between the trading partners, and related areas...

Språk

Publicerad

2007-10-10
PDF · 315 SEK
IEC/PAS 62396-4
Standard · IEC standard IEC/PAS 62396-4

Process management for avionics - Atmospheric radiation effects - Part 4: Guidelines for designing with high voltage aircraft electronics and poten...

Provides guidance on atmospheric radiation effects on high voltage, nominally above 200 V, avionics electronics used in aircraft operating at altitudes up to 60 000 feet. Is to be used in conjuncti...

Språk

Publicerad

2007-10-10
PDF · 315 SEK
IEC/PAS 62396-3
Standard · IEC standard IEC/PAS 62396-3

Process management for avionics - Atmospheric radiation effects - Part 3: Optimising system design to accommodate the Single Event Effects (SEE) of...

Provides guidance to those involved in the design of avionic systems and equipment. Builds on the initial guidance on the system level approach to Single Event Effects in IEC/TS 62396-1, considers ...

Språk

Publicerad

2007-10-10

Upphävd

2008-08-28
PDF · 315 SEK
IEC/PAS 62396-2
Standard · IEC standard IEC/PAS 62396-2

Process management for avionics - Atmospheric radiation effects - Part 2: Guidelines for single event effects testing for avionics systems

Provides guidance related to the testing of microelectronic devices for purposes of measuring their susceptibility to single event effects (SEE) induced by the atmospheric neutrons. Also shows how ...

Språk

Publicerad

2007-10-10

Upphävd

2008-08-19
PDF · 315 SEK
IEC/PAS 62396-5
Standard · IEC standard IEC/PAS 62396-5

Process management for avionics - Atmospheric radiation effects - Part 5: Guidelines for assessing thermal neutron fluxes and effects in avionics s...

Provides a more precise definition of the threat that thermal neutrons pose to avionics as a second mechanism for inducing single event upset in microelectronics.

Språk

Publicerad

2007-10-10

Upphävd

2008-08-19
PDF · 315 SEK
IEC/TR 62258-7
Standard · IEC standard IEC/TR 62258-7

Semiconductor die products - Part 7: XML schema for data exchange

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection struc...

Språk

Publicerad

2007-10-10
PDF · 350 SEK
IEC/TS 61994-1
Standard · IEC standard IEC/TS 61994-1

Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 1: Piezoelectric and dielectric resonators

Gives the terms and definitions for piezoelectric and dielectric resonators representing the present state-of-the-art, which are intended for use in the standards and documents of IEC TC 49. This n...

Språk

Publicerad

2007-10-10
PDF · 315 SEK
IEC/TS 61994-4-1
Standard · IEC standard IEC/TS 61994-4-1

Piezoelectric and dielectric devices for frequency control and selection - Glossary - Part 4-1: Piezoelectric materials - Synthetic quartz crystal

Gives the terms and definitions for synthetic quartz single crystals representing the present state-of-the-art, which are intended for manufacturing piezoelectric elements for frequency control and...

Språk

Publicerad

2007-10-10
PDF · 315 SEK
IEC 60747-4
Standard · IEC standard IEC 60747-4

Dispositifs à semiconducteurs - Dispositifs discrets - Partie 4: Diodes et transistors hyperfréquences

Provides requirements for the following categories of discrete devices: variable capacitance diodes and snap-off diodes, mixer diodes and detector diodes, avalanche diodes, gunn diodes,bipolar tran...

Språk

Publicerad

2007-10-10
PDF · 2.240 SEK
IEC 60747-5-5
Standard · IEC standard IEC 60747-5-5

Dispositifs à semiconducteurs - Dispositifs discrets - Partie 5-5: Dispositifs optoélectroniques - Photocoupleurs

This part of IEC 60747 gives the terminology, essential ratings, characteristics, safety test as well as the measuring method for photocouplers (or optocouplers). NOTE The word ""optocoupler"" can ...

Språk

Publicerad

2007-10-10
PDF · 1.750 SEK
IEC 60747-9
Standard · IEC standard IEC 60747-9

Dispositifs à semiconducteurs - Dispositifs discrets - Partie 9: Transistors bipolaires à grille isolée (IGBT)

This part of IEC 60747 gives product specific standards for terminology, letter symbols, essential ratings and characteristics, verification of ratings and methods of measurement for insulated-gate...

Språk

Publicerad

2007-10-10
PDF · 1.750 SEK
IEC 61193-2
Standard · IEC standard IEC 61193-2

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

Applies to the inspection of electronic components, packages, and also modules (referred to as ""products in this standard) for use in electronic and electric equipment. It specifies sampling plan...

Språk

Publicerad

2007-10-10
PDF · 315 SEK
IEC/TR 62258-4
Standard · IEC standard IEC/TR 62258-4

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection s...

Språk

Publicerad

2007-10-10

Upphävd

2012-08-08
PDF · 315 SEK
IEC 60068-2-69
Standard · IEC standard IEC 60068-2-69

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wettin...

Outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of ...

Språk

Publicerad

2007-09-05
PDF · 350 SEK
IEC 60191-1
Standard · IEC standard IEC 60191-1

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

Gives guidelines on the preparation of outline drawings of discrete devices. For preparation of outline drawings of surface mounted discrete devices, IEC 60191-6 should be referred to as well. The ...

Språk

Publicerad

2007-09-05
PDF · 700 SEK
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