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Standard · EUROPEISK ELSTANDARD DS-EN 62047-8:2011

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the con...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 62047-5:2011

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

This part of IEC 62047 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. T...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 62047-9:2011

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and ...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 62047-7:2011

Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection

This part of IEC 62047 describes terms, definition, symbols, configurations, and test methods that can be used to evaluate and determine the performance characteristics of BAW resonator, filter, an...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60749-20:2009

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture ...

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This seco...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60749-20-1:2009

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensit...

This part of IEC 60749 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.The purpose of this document is to provide SM...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60758:2009

Synthetic quartz crystal - Specifications and guidelines for use

This International Standard applies to synthetic quartz single crystals intended for manufacturing piezoelectric elements for frequency control and selection.

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 62604-2:2012

Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) duplexers of assessed quality - Part 2: Guidelines for the use

This part of IEC 62604 concerns the duplexers, which can separate receiving signal fromtransmitting signal and are key components for two-way radio communications. They aregenerally used in mobile ...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60689:2009

Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values

This International Standard applies to measurements and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values for frequency control and selection.

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60286-5/A1:2009

Packaging of components for automatic handling - Part 5: Matrix trays

Describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placi...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60115-8:2012

Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors

IEC 60115-8:2009(E) is applicable to fixed surface mount resistors for use in electronic equipment. These resistors are typically described according to types (different geometric shapes) and style...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60297-3-100:2009

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions ...

This part of IEC 60297 specifies the basic dimensions of front panels, subracks, chassis, racks and cabinets of the 482,6 mm (19 in) series. Subsequent standards of the associated IEC 60297-3 serie...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60297-3-105:2009

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and de...

This part of IEC 60297 specifies the dimensions for 1U chassis mounted into IEC 60297-3-100 compliant racks/cabinets where dimensions, loaded weight and accessibility require differing assembly met...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60747-16-3/A1:2009

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave frequency converters.

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60747-16-4/A1:2011

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

Provides new measuring methods, terminology and letter symbols, as well as essential ratings and characteristics for integrated circuit microwave switches. Switches in this standard are based on SP...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60747-15:2012

Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices

La CEI 60747-15:2010 donne les exigences relatives aux dispositifs de puissance à semi-conducteurs isolés avec circuits de commande intégrés. Ces exigences s'ajoutent à celles données dans d'autres...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 140401-801:2007

Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 140401-802:2007

Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 140401-803:2007

Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 140100:2008

Sectional Specification: Fixed low power film resistors

This sectional specification prescribes the preferred values for characteristics and ratings and also theinspection requirements for fixed film resistors of assessed quality. These resistors genera...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 140401:2009

Blank Detail Specification: Fixed low power film surface mount (SMD) resistors

A blank detail specification is a supplementary document to the sectional specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifica...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 140401-802/A1:2010

Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 140401-803/A1:2010

Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 140401-804:2011

Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25

This European Standard was prepared by Technical Committee CENELEC TC 40XB, Resistors.The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 140401...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60191-6-18:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semicondu...

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum...

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), an...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60679-6:2011

Quartz crystal controlled oscillators of assessed quality - Part 6: Phase jitter measurement method for quartz crystal oscillators and SAW oscillat...

IEC 60679-6:2011 applies to the phase jitter measurement of quartz crystal oscillators and SAW oscillators used for electronic devices and gives guidance for phase jitter that allows the accurate m...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60738-1/A1:2009

Thermistors - Directly heated positive temperature coefficient - Part 1: Generic specification

This International Standard prescribes terms and methods of test for positive step-functiontemperature coefficient thermistors, insulated and non-insulated types, typically made fromferro-electric ...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60603-7-41:2010

Connectors for electronic equipment - Part 7-41: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with...

IEC 60603-7-41:2010 covers 8-way, unshielded, free and fixed connectors, references dimensional, mechanical, electrical and environmental characteristics and tests in IEC 60603-7, and specifies ele...

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2013-06-04

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Standard · EUROPEISK ELSTANDARD DS-EN 60603-7-51:2010

Connectors for electronic equipment --Part 7-51: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with f...

IEC 60603-7-51:2010 covers 8-way, shielded, free and fixed connectors, references dimensional, mechanical, electrical and environmental characteristics and tests in IEC 60603-7, and specifies elect...

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2013-06-04

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