Determines the ability of components, equipment and other articles to be stored, transported or used under low air pressure conditions.
1983-01-01
Includes a number of tests which use different conditioning procedures appropriate for different application.
1994-07-07
Contains Test Ba: Dry heat for non-heat-dissipating specimen with sudden change of temperature; Test Bb: Dry heat for non-heat-dissipating specimen with gradual change of temperature; Test Bc: Dry...
1974-01-01
2007-07-01
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1993-02-26
1994-05-31
Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
1979-01-01
Incorporates Amendment No. 1
1987-01-01
Describes a continuous test at a steady temperature of 40°C and a relative humidity of 90-95%. The standard test duration is 4 to 56 days.
1969-01-01
2001-08-20
Determines the suitability of components, equipment and other articles for use and/or storage under conditions of high humidity when combined with cyclic temperature changes.
1980-01-01
2005-08-01
Replaces the third paragraph of Clause 8, Recovery.
1985-01-01
Determines the effect on a specimen of standard treatments which are representative of the falls likely to occur during rough handling. Has the status of a basic safety publication in accordance w...
1975-01-01
Incorporates Amendment No. 1 (1982).
1990-10-31
Applies to aircraft components and equipment, particularly to those installed in unheated or unpressurized conditions.
1976-01-01
Applies to heat-dissipating and non-heat-dissipating specimens and is a test to determine the ability of components, equipment and other articles to be stored and used under a simultaneous combinat...
Amends the preferred combinations of temperature, air pressure and duration.
Applies to heat-dissipating and non-heat-dissipating specimens and is a the test is to determine the ability of components, equipment and other articles to be stored and used under a simultaneous c...
Provides an accelerated means of assessing the corrosive effect of atmospheres polluted with sulphur dioxide on contacts and connections.
1982-01-01
2003-05-23
Provides an accelerated means of assessing the effect of tarnishing on silver and silver alloys used for contacts and connections. Is particularly suitable for comparative information, but not as a...
Provides background information and recommendations for writers of specifications containing references to IEC 68-2-20, IEC 68-2-54 and IEC 68-2-58.
1995-01-30
Applies to electronic components and other parts mounted on printed circuit boards which may be subjected to cleaning operations. Also gives information on test solvents and test temperatures.
1993-02-15
Gives guidance on the effect of hydrogen sulphide on electrical contacts and the significance of the test in IEC 68-2-43 on the behaviour of contacts exposed to such atmospheres.
May be used as an acceptance test in type approval of components or equipment from a supplier or to compare materials, processes or designs.
Determines the solderability of component terminations of any shape. Specially suitable for reference testing and components that cannot be quantitatively tested by other methods.
2006-04-27
Determines the suitability of electrotechnical products, principally equipment, for use and storage under conditions of high humidity.
1988-12-14
2002-01-01
Determines the corrosive influence of operating and storage indoor environments on electrotechnical products components, equipment and materials, particularly contacts and connections, considered s...
1995-12-13
Specifies a 'climatic sequence' for products, primarily components, that is based on clause 7 of IEC 68-1. Includes guidance for specification writers and those performing the test.
1991-07-02
Provides a standard test procedure for the prupose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the d...
1994-06-22
Provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the d...