Standard - Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste - IEC 60068-2-83

	Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste Standard · IEC standard IEC 60068-2-83
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IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in I

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Essais d'environnement - Partie 2-83: Essais - Essai Tf: Essai de brasabilité des composants électroniques pour les composants pour montage en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser