1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This
ASTM
Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009)
STD-50749
1986
1998-05-10
3