1.1 This practice describes a method for ultrasonic mapping of the soundness of a bond joining a sputtering target to its supporting backing plate. The results of the examination may be used in predicting the target-backing plate assembly's
ASTM
Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
STD-50754
1994
2011-06-01
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