1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are in This specification covers refractory silicide sputtering targets for use in microelectronic applications. Targets shall be classified by the following major constituents: molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide.