1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.This standard does not purport to address all of th
ASTM
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
STD-52726
1999
1999-10-10
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