1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.1.2 The val
ASTM
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
STD-52081
2001
2001-09-10
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