Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards

Standard · IEC standard

IEC 60249-3-3

Status

Invalid

Replaced by

IEC 61249-2-12, IEC 61249-2-13, IEC 61249-2-19, IEC 61249-2-4, IEC 61249-2-7, IEC 61249-2-18, IEC 61249-2-8, IEC 61249-2-9, IEC 61249-2-10, IEC 61249-2-21, IEC 61249-2-5, IEC 61249-2-6, IEC 61249-2-11, IEC 61249-2-1, IEC 61249-2-22, IEC 61249-2-23, IEC 61249-2-26, IEC 61249-2-2

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Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board. Solder resist for the uses considered in this specif

Product information

Language

Written by

IEC

International title

Matériaux de base pour circuits imprimés - Troisième partie: Matériaux spéciaux utilisés en association avec les circuits imprimés - Spécification n° 3: Matériaux de revêtement permanent en polymère (épargne de brasage) pour utilisation dans la fabricatio